A two-step roadmap
Huawei will launch two new artificial intelligence chips in 2027, rotating chairman David Wang said on Thursday at a company event in Shanghai. The 960DT is planned for the first quarter of 2027, followed by the Ascend 960PR in the third quarter.
The company is also building technology to link very large numbers of AI processors so they behave as one bigger computing system, because most advanced AI programs need far more processing power than a single chip can supply.
Wiring chips together
Wang said Huawei's UnifiedBus interconnect technology would be the key link in its next generation of large AI systems, helping chips share information and work together more efficiently. Huawei says it has already shipped more than 1,000 of these large systems to more than 370 customers.
For buyers, the pitch is scale rather than a single record-breaking part: cluster hundreds or thousands of processors and the system, not the die, becomes the unit of performance.
The export-control backdrop
Washington has imposed export controls that restrict China's access to certain advanced computing chips and semiconductor manufacturing equipment, while Chinese companies and policymakers have placed more weight on building domestic alternatives. That has made the ability to connect chips increasingly important for Chinese technology firms, and it has turned interconnect and packaging into battlegrounds alongside raw compute.
Huawei is positioning itself as the domestic answer to Nvidia, whose accelerators still dominate AI training worldwide. Analysts caution that Huawei's parts are used mainly for inference rather than training the largest models, and that manufacturing capacity remains a constraint. The 2027 dates give customers a timeline to plan around, and they put pressure on rival roadmaps in the same window.
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